• 8GB of LPDDR4X
    • 64GB eMMC onboard
    • Wi-Fi 6 2x2 wireless connectivity
    • 2x MIPI CSI connectors with 13MP and 8MP cameras
    • 2x USB 2.0 ports | 1x Micro SD card slot | 1x HDMI Tx port 1x RJ45
    • Fast Ethernet Raspberry Pi compatible 40-pin GPIO
    • 7-inch Full HD LCM touch panel
    G350_EVK_logo-trans
    Genio700_devkit
    • LGA312 package 
    • Max memory and storage: 8GB LPDDR4, 64GB eMMC 
    • Temp support: -30° C to +85° C 
    • Supports 2x USB 2.0, 1x USB 3.1,  1x PCIE, 1x eDP, 1x DP, 6x SPI, 4x UART, 1x AUX, 2x MSDC  7x I2C (up to 2xI3S included), 2x I2S, 1x PCM, 2x DMIC,  4xCSI, 2x DSI, 1x DPI, 1x HDMI, 4x PWM,  1x RGMII 
    Grinn-GenioSOM-700-boxed
    GRINN-LOGO-boxed
    • MT8390 Edge-AI SoC
      • Hexa-core Arm Cortex-A55 2GHz
      • Dual core Arm Cortex-A78 2.2GHz
    • 4GB / 8GB LPDDR4x, 64GB eMMC
    • Linux Yocto OS / Android 13(on request)
    • SMARC 2.1.1 specification
    • 82mmx 50mm Form Factor
    • SMARC Carrier Board
    Tessolve_Logo-boxed
    Genio700_Tessolve
    • SMARC 2.1.1 Form Factor
    • ARM Mali-G57 MC3
    • Up to 8GB LPDDR4X
    • 2x GbE, 1x CAN, 4x UART, TPM integrated
    • Optional carrier board with Rich I/O feature set
    • Android, Yocto Linux
    SECO-SOM-SMARC-Genio700_500-boxed
    SECO_Logo-boxed
    • Onboard 4GB LPDDR4 /16GB eMMC or 8GB LPDDR4 /16GB eMMC
    • Optional Wi-Fi 6 and Bluetooth 5.3
    • Onboard ethernet PHY's and USB hub Controller
    • Commercial (0° to +70 °C) or Industrial (-40° to +85 °C) versions
    • SMARC 2.1.1 Form Factor SOM 82mm x 50mm SMARC edge connector
    • Assembled in the USA
    IoT_devkit_ezurio
    Tungsten-700-MT320-M.2-1420-Front
    • 2x ARM Cortex [email protected]  GHz, + 6x ARM Cortex [email protected]
    • GPU ARM Mali-G57 MC3, support for OpenGL/CL/Vulkan
    • 4-channel LPDDR4X 3733Mbps up to 8GB
    • 95 x 115MM Single Board Computer/Eval Kit
    • Embedded powerful multi-core Al processors for Edge Al Applications
    Pumpkin-700-EVK
    OLogic_devkit_logo
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